3D XPoint CMP Senior/Principal Process Development Engineer (Lehi Tech Center)


Req. ID: 120338 

This position will be based in Micron's joint venture facility in Lehi, UT. As a Senior or Principle CMP Process Development Engineer in the Technology Development Group, you will work closely with F4 and JDP team in industry-leading semiconductor process technology. In this position you will be responsible for the evaluation of new hardware platforms, new consumable development, drive CMP Process technology roadmap and partner with vendors to develop processes that meet device requirements for CMOS and Interconnect modules for next generation 3DXP nodes. You will act as CMP key point of contact for your module to enable early array module process transfer from F4 to HVM and in collaboration with Equipment Engineers, Process Engineers , Process Integration Engineers from LTC and Fab 2 perform rigorous process characterization and drive execution of critical CMP projects post transfer to meet technode gate and milestone criteria.



  • Develop dielectric and Metal CMP processes that meet performance, timeline and cost requirements

  • Design, optimize and characterize CMP Processes needed for successful integration

  • Organize well designed experiments to understand the interaction between process and hardware parameters and use this knowledge to optimize for best performance

  • Develop and evaluate innovative solutions to improve process margins

  • To work with various integration/structural impacts and constraints to enable functional device

  • To derive insightful inferences from the analysis of physical and electrical data and utilize the understanding to modify processes to meet the device requirements

  •  Development of new processes, including evaluation of new hardware platforms and new consumables

  • Qualifying conversions and new processes, defining process margin

  • Transfer processes to pilot production and high volume manufacturing facilities

  • Drive R&D CMP Process technology roadmap for CMOS and Interconnect Module


Required Skills:

  • Hands-on experience with CMP polishing equipment, which includes familiarity with equipment operation, optical metrology, profilometry, common polishing slurries, and polishing pads.

  • In-depth understanding of polishing mechanisms for dielectric and metal CMP.

  • Knowledge of material properties and characterization techniques.

  • Strong understanding of circuit processing and semiconductor devices.

  • Strong aptitude for research and development with interest and capability to create production worthy technologies.

  • Be a critical thinker and at the same time be a team player and handle constructive criticism from other team members and leverage input to drive projects forward

  • Possess a high degree of self-motivation, goal orientation and the ability to aggressively focus on solving problems and to learn new skills.

  • Have the ability to plan and execute well-designed experiments and report results in clear concise reports.

  • Demonstrate dependability and willingness to take on responsibilities.

  • Expertise in new process/tool technology assessment

  • Ability to work on multiple projects and work through cross-disciplinary and cross-organizational logistical issues.

  • Strong communication and reporting skills both written and verbal.

  • Proactive approach to problem/project management and good problem solving skills

  • Strong teamwork skills.



PhD in Chemistry, Material Science, Physics, Chemical Engineering, Mechanical Engineering or related field of study with 3 plus years" experience OR



MS/BS degree in Chemistry, Material Science, Physics, Chemical Engineering, Mechanical Engineering or related field of study with 5 plus years" experience

We recruit, hire, train, promote, discipline and provide other conditions of employment without regard to a person's race, color, religion, sex, age, national origin, disability, sexual orientation, gender identity and expression, pregnancy, veteran's status, or other classifications protected under law.  This includes providing reasonable accommodation for team members' disabilities or religious beliefs and practices.

Each manager, supervisor and team member is responsible for carrying out this policy. The EEO Administrator in Human Resources is responsible for administration of this policy. The administrator will monitor compliance and is available to answer any questions on EEO matters.

To request assistance with the application process, please contact Micron's Human Resources Department at 1-800-336-8918 (or 208-368-4748).

Keywords:  Lehi Utah (US-UT) United States (US) Technology Development Experienced Regular Engineering #LI-KV1

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